The article mentions backside (underside) power distribution, capacitors to help regulate voltage (thus allowing tighter tolerances and lower voltage / operating power), voltage regulation under the chip, and finally dual-layer stacking with the above as potential avenues to spread heat dissipation.
I can't help but wonder, where exactly is that heat supposed to go on the underside of the chip? Modern CPUs practical float atop a bed of nails.
a second heatsink mounted the back of the chip? maybe the socket the chip in suck a way the back touches a copper plate attached to some heatpipes? plenty of options
I mean, there's no real reason a chip has to be a wafer.
A toroidal shape would allow more interconnects to be interspaced throughout the design as well as more heat-transfer points alongside the data transfer interconnects.
Something like chiplet design where each logical section is a complete core or even an SOC with a robust interconnect to the next and previous section.
If that were feasible, you could build it onto a hollow tube structure so that heat could be piped out from all sides once you sandwich the chip in a wraparound cooler.
I guess the idea is more scifi than anything, though. I doubt anyone other than ARM or RISC-V would ever even consider the idea until some other competitor proves the value.